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Advanced MEMS packaging

Published: New York : McGraw-Hill, c2010
Format: Print
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Electronics manufacturing : with lead-free, halogen-free, and conductive adhesive-materials

Published: New York : McGraw-Hill, c2003
Format: Print
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Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies

Published: New York : McGraw-Hill, 2000
Format: Print
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Microvias : for low cost, high density interconnects

Published: New York : McGraw-Hill, c2001
Format: Print
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Through-silicon Vias for 3d Integration

Published: New York: McGraw-Hill, 2013
Format: Print
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